Delivering an unprecedented 2X performance, up to 70% lower power, up to 10.2 million LEs, and the highest level of system integration†, Intel® Stratix® 10 devices are uniquely positioned to address next-generation, high-performance systems in the most demanding applications including communications, data center acceleration, high-performance computing, radar processing, ASIC prototyping, and many more.

Data Center Acceleration

Cognitive Computing


High-performance accelerators

  • Up to 8.6 TFLOPS.
  • Highest fabric performance.
  • Highest memory bandwidth.

Algorithm flexibility

  • OpenCL™1platform.
  • Software front end for security and flow control with integrated ARM* Cortex*-A53 hard processor system.

Unique to Intel® Stratix® 10 Devices

  • First FPGA devices to support Intel® Ultra Path Interconnect (UPI) for direct coherent connection to Intel® Xeon® Scalable processor.
  • FPGA PCIe* hard IP with configuration up to Gen4 x16 at 16 Gbps.
  • HyperFlex FPGA Architecture delivers up to 1 GHz performance, enabling breakthroughs in computational throughput.
  • Hardened single-precision floating-point DSP block, compliant with IEEE 754 standard, delivers GPU-class floating performance at a fraction of the power.
  • Hardened AI Tensor Block tuned for common matrix-matrix or vector-matrix multiplications in AI acceleration applications resulting in up to 15X more INT82 throughput than standard DSP Block.
  • Secure cloud solutions using the security features.


Bridging and Aggregation

Enabling New Network Infrastructure


High throughput with power efficiency

  • Up to 10 TFLOPS 400G traffic manager with 600 million packet per second throughput.
  • Less than 1 watt per 10 Gbps.

Flexible, high-performance interconnect

  • Adaptable, scalable, and optimized IP portolio including 400G Ethernet.
  • Integrated processor for system monitoring and management.

Unique to Intel® Stratix® 10 Devices

  • fMAX over 700 MHz using the Intel® HyperFlex™ FPGA Architecture enabling 400G Ethernet.
  • 512 bit wide datapath running at 2X performance enables half-size IP compared to conventional architectures.

OTN/Data Center Interconnect

400 Gbit/s Muxponder for Metro / DCI



  • Four OTU4 line side interface.
    • OTL4.4.
    • GFEC.
    • ODUk/flex – ODU4 multiplexer.
  • 20 ‘any rate’ client interfaces.
    • 16 interfaces from 1GE to 25GE/32GFC
      Alternatively 4 x 100GE.
    • 4 interfaces of 1-14G.
  • Cross-connect.
    • Full add/drop connectivity between line-line and line-client.
    • Protection switching.

Optional Features

  • 128GFC client.
  • KP-FEC (544, 514) for clients.
  • PAM4 transceivers.

2.4 Tbit/s Switch/Muxponder for DCI



  • 2.4 Tbit/s cross-connect between Ethernet flows.
  • 1.2 Tbit/s FlexE muxponder/transponder.
  • (528,514,10) RS-FEC and (544,514,10) KP-FEC support.
  • Optical interfaces: FlexE server, 100GE, 25GE, 10GE.
  • FlexE configurable as 400G/200G+200G/100G+300G.
  • Cross-connect supports: 10/25/50/100GE flows.
  • Low power FEC Hard IP while providing fabric flexibility.

Unique to Intel® Stratix® 10 Devices

  • Heterogeneous 3D System-in-Package (SiP) integration of transceiver tiles delivers 30G backplane support with a path to 58G data rates.
  • HyperFlex FPGA Architecture enables 2X performance resulting in significant IP size reduction.
  • Hardened single-precision floating-point DSP block, compliant with IEEE 754 standard, delivers GPU-class floating performance at a fraction of the power.
  • Secure cloud solutions using the security features.


Digitizing the Radar Front-End


Highest performance per watt

  • Up to 10 TFLOPS single-precision floating-point performance.
  • Up to 80 GFLOPS/Watt.

High-throughput front end

  • High number of simultaneous beams with high bandwidth.
  • Beam former IP.

Unique to Intel® Stratix® 10 Devices

  • Up to 10 TFLOPS of IEEE 754 compliant single-precision floating-point performance delivers GPU class performance at a fraction of the power.
  • Cover fMAX up to 1 GHz enabling high throughput beam processing.

ASIC Prototyping and Emulation

Highest FPGA Fabric Capacity


Highest density for scalability

  • 10.2 million LE core fabric.

Debug productivity

  • Readback and writeback IP.

Highest I/O counts for flexibility

  • 2,300+ I/Os.

Integration with multiple fabric and transceiver chiplets

  • Intel® Embedded Multi-Die Interconnect Bridge (EMIB) technology.

Unique to Intel® Stratix® 10 Devices

  • Highest density enable customers to scale prototyping and emulation solution.
  • Highest I/O counts provide flexibility for design partitioning across multiple FPGAs.
  • Readback and writeback IP enhances debug productivity.

Cyber Security

Network Intrusion Detection and Prevention

400G Throughput Bump-in-the-Wire


Line rate analysis of data traffic

  • From 1G to 400G.
  • Implement Intrusion Prevention Systems (IPS) and Intrusion Detection Systems (IDS) on streaming traffic.


  • Security performed on traffic flows prior to entering network.
  • Continuous network monitoring or tagging of live traffic.

Unique to Intel® Stratix® 10 Devices

  • fMAX over 900 MHz allows monitoring of all supported protocols at line rates.
  • ARM* Cortex*-A53 processor enables direct interfacing with existing IT software.
  • Partial reconfiguration and OpenCL™ platform allow for easy rules updates.

Intel® Stratix® 10 FPGA Reference Links

Infos sur le produit et ses performances

1OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos.

Basé sur des estimations internes d'Intel.
Les tests mesurent les performances des composants dans un test particulier et dans des systèmes spécifiques. Toute différence matérielle, logicielle ou de la configuration risque d'avoir une incidence sur les performances effectives. Consultez d'autres sources d'information pour évaluer les performances alors que vous considérez un achat. Pour en savoir plus sur les performances et les résultats des bancs d'essai, rendez-vous sur
Les technologies Intel® peuvent nécessiter du matériel, des logiciels ou l'activation de services compatibles.
Aucun produit ou composant ne saurait être totalement sécurisé en toutes circonstances.
Les résultats ont été estimés ou simulés. Vos coûts et résultats peuvent varier.
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