Delivering World-Class Quality Leadership
Intel Quality and Reliability
Quality and Reliability at a glance
- Intel's manufacturing quality processes
- Customer manufacturing enabling program
- Quality document management system
- Functional analysis
- Customer information service portal
State-of-the-art manufacturing quality processes support sustaining and advancement of our semiconductor manufacturing technologies.Learn more >
Intel® Customer Manufacturing Enabling brings Intel® technology and manufacturing expertise to customers to increase manufacturing success for customers, to assure growth in new areas, and to provide services for process optimization.Learn more >
Search, view, and download product change notice (PCN) and material declaration data sheet (MDDS) information.Learn more >
Intel's analysis labs unite experts with state of the art capabilities to support product qualification, manufacturing, and customer needs.Learn more >
CISP is a portal to enable customer access to Quality and Reliability content. This site provides customers with access to frequently-asked subject areas such as ecology, product information, reliability, manufacturing enabling documents, and product change notices through search, view, and download.Learn more >
Your resource guide to assist in facilitating access to information such as International Standards (ISO), and other resourceful documents and downloads.View resources >
VidéosPlus de vidéos
Vishay Micro-Measurements Strain Gage
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Electrostatic Discharge Prevention Methods
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Antenna and Oscilloscope: Electrostatic Discharge Detection
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel® LGA115X Socket: System Integration Factory
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Measuring I/O Shield Alignment
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Package-on-Package Devices: Ball Grid Array Rework
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Handling Recommendations: Manufacturing with Intel® Products
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Corner Glue: Application Techniques and Materials
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Intel® LGA115X Socket: Mandarin Board Factory
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
Kyowa Strain Gage
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Intel® LGA115X Socket: Board Factory
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Automaker GM Speeds IT for Success
GM leaders discuss rapid data sharing to bring vehicles to market faster and increase sales.