D1C ISO 9001:2008
Certifies that Intel Corporation—D1C in Hillsboro, Oregon, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.
Read the full D1C ISO 9001:2008 Certification.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.