The objective of the Intel® validation program is to verify compliance to the industry specification and the Intel specification addendum for AMB and FBDIMM. This program also shows functionality of modules and its components in Intel® reference systems, so as to provide a guideline for memory compatibility with Intel® chipsets. This validation will be performed by an approved lab on a sample of modules and is intended to demonstrate supplier design and manufacturing capability. The validation process uses standardized procedures and methodologies documented in the Intel validation specification for AMB and FBDIMM. The procedure is not intended to replace the OEMs' qualification process.
Validation process overview
|FBDIMM & AMB validation|
|Validation Tests||AMB Validation||FBDIMM Validation|
|Functional Memory Stress Test @ Process, Temp, and Voltage corners at platform level||Yes||Yes|
|Power Management Tests (Power and Reset cycling)||Yes||Yes|
|Functional Memory Stress @ Temp & Voltage Corners at CTC level||Yes||Yes|
|MD Screen & SPD check||Yes||Yes|
|AMB Temp Control & Accuracy||Yes||NA|
|Signal Integrity – Serial link interface||Yes||NA|
|Signal Integrity – DRAM interface||NA||Yes|
Intel specification addendum for AMB/FBDIMM
AMB/FBDIMM compliance sheet
Approved test labs
For a list of approved test labs, please refer to the appropriate validation results page.
- Intel® Platform Memory
DRAM and module validation homepage.
Additional information: 1