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FBDIMM and AMB Validation Process

The objective of the Intel® validation program is to verify compliance to the industry specification and the Intel specification addendum for AMB and FBDIMM. This program also shows functionality of modules and its components in Intel® reference systems, so as to provide a guideline for memory compatibility with Intel® chipsets. This validation will be performed by an approved lab on a sample of modules and is intended to demonstrate supplier design and manufacturing capability. The validation process uses standardized procedures and methodologies documented in the Intel validation specification for AMB and FBDIMM. The procedure is not intended to replace the OEMs' qualification process.

Validation process overview

FBDIMM & AMB validation
Validation Tests AMB Validation FBDIMM Validation
Functional Memory Stress Test @ Process, Temp, and Voltage corners at platform level Yes Yes
Power Management Tests (Power and Reset cycling) Yes Yes
Functional Memory Stress @ Temp & Voltage Corners at CTC level Yes Yes
MD Screen & SPD check Yes Yes
AMB Temp Control & Accuracy Yes NA
IDD Check Yes NA
Protocol Test Yes NA
Thermal Resistance NA Yes
Signal Integrity – Serial link interface Yes NA
Signal Integrity – DRAM interface NA Yes
Transparent Mode Yes NA
AMB Power Yes NA
CRC Injection Yes NA
AMB Interoperability Yes NA

Intel specification addendum for AMB/FBDIMM

AMB/FBDIMM compliance sheet

Approved test labs

For a list of approved test labs, please refer to the appropriate validation results page.

Validation results

Additional information: 1

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