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Calpella Platform Component: Thermal Models

Files: Thermal simulation models and user guide for the Calpella platform assist in development of system level thermal solutions.

App Addendum: Intel® Core™ i5 Processor 520E

App Power Addendum: Provides power numbers for the Intel® Core™ i5 processor 520E while running real-life applications. (v.1, Jan. 2011)

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Intel® Atom™ Processor N2000/D2000: Guideline Addendum

Updates Intel® Atom™ processor N2000/D2000 series embedded application power guidelines with power numbers from real life applications.

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Reducing S3 State Power on Calpella Platform

White Paper: Describes a system-level implementation to reduce processor power use on the Calpella platform during ACPI S3 state. (v.1, Aug. 2009)

Intel® EP80579 Integrated Processor Fanless System: Thermal Guide

Thermal Design Guide: Thermal and mechanical considerations for the Intel® EP80579 Integrated Processor in fanless applications. (v. 001, Aug. 2008)

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Intel® EP80579 Integrated Processor Product Line: Thermal Guide

Thermal Guide: Thermal and mechanical specifications and solutions for the Intel® EP80579 Integrated Processor product line. (v. 002, Oct. 2008)

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Intel® Xeon® Processor C5500/C3500 Series: Thermal Design Guide

Thermal Design Guide: Provides thermal and mechanical design guidelines for the Intel® Xeon® Processor C5500/C3500 series. (v.002, Aug. 2010)

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Intel® Core™ i7-800/i5-700 Desktop Processor Series: Guide

Design Guide: Thermal and mechanical operating limits and specifications for Intel® Core™ i7-800/i5-700 desktop processor series. (v.2, Sept. 2009)

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Application Power Guidelines Intel® Atom™ Processor E6xx: Addendum

Application power guidelines provide power numbers on the Intel® Atom™ processor E6xx while running real life applications.

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BOM Cost Reduction: Remove Intel® Atom™ Processor E6xx S3 State

White Paper: Intel® Atom™ processor E6xx power state overview shows Bill of Materials (BOM) cost reduction by removing S3 state. (v.001, May 2011)

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